Skip to content

Multilayer PCB Has A lot more Than Two Conductive Copper Layers

Multilayer PCB has more than 2 conductive copper tiers which mainly consist of inner level cores, prepreg layers and copper foils and they? re melted together via heat and pressure. Lamination process is one of the key to handle good quality of multilayer PCB, this procedure requires specific heating system and pressure with regard to specific durations dependent on materials utilized to ensure the PCB board is produced properly.

The multilayer PCB is the particular development of typically the double sided PCB with increasing complexity and density of components, they permitted the designers to produce highly complicated and compact brake lines and further development of blind and buried via gap technology has pressed these limits also further.

With typically the requirements of larger precision in various applications, the demands regarding multilayer PCB maintain increasing continuously in recent years. The typical apps of multilayer imprinted circuit boards contain Computers, Data storage, Cell phone transmitting, GPS technology, satellite television systems and thus on.

A-TECH is usually an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing procedure in house coming from inner layer, machine lamination to surface area finishes, it brings us more positive aspects in the opposition of global marketplace shares for multilayer printed circuit panels on quality, value and lead moment. Currently the proportion of multilayer PCB all of us manufactured is even more than 65%.

multilayer pcb HDI PCB, the entire name is High Density Connect PCB, it needs very much higher wiring density with finer trace and spacing, more compact vias and larger connection pad density. Blind and smothered vias? design any of their designated feature. HDI PCB are widely applied for Mobile phone, tablet computer, digital camera, GPS, LCD module and other different region.

A-TECH CIRCUITS provides HDI PCB production services to globally customers in the particular top quality automotive business, medical computer market, mobile, computing and defense industry.

Currently the advanced HDI technology we utilized include: "Direct Laser Drill"(DLD) is going of copper layer by direct CARBON DIOXIDE laser irradiation, beat additional laser going with conformal cover up, the copper primary laser drilling is capable of providing larger accuracy, better opening quality and better efficiency for HDI projects. "Copper Filled" for special bunch microvia, "Laser Immediate Imaging"(LDI) is particularly designed for great line technology, to be able to eliminate dimensional stability problem of art caused by environment and material issues.